Method and apparatus for processing samples
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United States of America Patent
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Jan 24, 2006
Issued Date -
N/A
app pub date -
Jul 31, 2001
filing date -
Feb 27, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is apparatus for treating samples, and a method of using the apparatus. The apparatus includes processing apparatus (a) for treating the samples (e.g., plasma etching apparatus), (b) for removing residual corrosive compounds formed by the sample treatment, (c) for wet-processing of the samples and (d) for dry-processing the samples. A plurality of wet-processing treatments of a sample can be performed. The wet-processing apparatus can include a plurality of wet-processing stations. The samples can either be passed in series through the plurality of wet-processing stations, or can be passed in parallel through the wet-processing stations.
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