Method for making an integrated circuit of the surface-mount type and resulting circuit
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United States of America Patent
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Jan 24, 2006
Grant Date -
N/A
app pub date -
Jul 18, 2000
filing date -
Jul 18, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention relates to a method for making an integrated circuit (40) of the surface-mount type the comprising, first of all, manufacture of a package having a rear face and a pin grid array extending under this rear face perpendicular thereto, and a ball (44) of low melting point alloy is then formed at the end of each pin surrounding this end and soldered thereto. The invention also relates to an integrated circuit (40) of the surface-mount type, comprising a package having a rear face and a pin grid array, of a cross section roughly constant along the pin (42), extending under the rear face perpendicular thereto. A ball (44) of low melting point alloy is soldered to the end of each pin (42) surrounding this end.
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