Process for preparation of semiconductor wafer surface

United States of America Patent

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Jan 31, 2006
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Jun 9, 2005
app pub date
Dec 4, 2003
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Dec 4, 2003

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Abstract

A method for adjusting the resistivity in the surface of a semiconductive substrate including selective measurement and counter-doping of areas on a major surface of a semiconductive substrate.

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Patent Owner	Address
INFINEON TECHNOLOGIES AMERICAS CORP	101 PACIFIC COAST HIGHWAY EL SEGUNDO CA 90245

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Andoh, Kohji	El Segundo, CA	11	157
Chiola, Davide	Marina del Rey, CA	29	466

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Process for preparation of semiconductor wafer surface

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United States of America Patent

10728482

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PATENT NO	6991943
APP PUB NO	20050124085A1
SERIAL NO	10728482
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 31, 2006	US,6991943,B2 US6991943B2	GRANTED PATENT AS SECOND PUBLICATION
June 09, 2005	US,20050124085,A1 US20050124085A1	FIRST PUBLISHED PATENT APPLICATION

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10728482

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