Underfill and encapsulation of carrier substrate-mounted flip-chip components
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United States of America Patent
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Jan 31, 2006
Issued Date -
N/A
app pub date -
Aug 11, 2004
filing date -
Aug 8, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for underfilling and encapsulating flip-chip-configured semiconductor devices mounted on a carrier substrate using stereolithography (STL) to form, in situ, at least semisolid dam structures of photopolymeric material about the devices to entrap liquid, unpolymerized resin between the devices and substrate is disclosed. Prior to the STL process, the carrier substrate and mounted devices are immersed in the liquid polymeric resin, optionally with vibratory energy, to purge contaminants from between the device and substrate, and to fill spaces between the semiconductor devices and carrier substrate with the liquid resin.
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