Method for electrical interconnection of angularly disposed conductive patterns
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United States of America Patent
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Feb 7, 2006
Grant Date -
Jun 9, 2005
app pub date -
Dec 4, 2003
filing date -
Dec 4, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for electrical interconnection of angularly disposed and abutted conductive patterns is disclosed along with a device created from the method. Conventional wire bonding equipment is used to apply a conductive metal ball at the junction of angularly disposed conductive patterns by orienting a cornerbond assembly whereby one or more conductive metal balls are orthogonally applied and electrically connected to the respective conductive patterns.
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