Process, apparatus, and system for adhesive bond strength recovery using joule heating
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United States of America Patent
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Feb 7, 2006
Grant Date -
Jul 8, 2004
app pub date -
Jan 8, 2003
filing date -
Jan 8, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process, apparatus, and system are presented for adhesive bond strength recovery in a bonded system, which may be an electronic device, such as, a magnetic drive or magnetic disk drive. The adhesive bond strength of an adhesive bonding material degrades over time and under certain ambient conditions, such as humidity. The process, apparatus, and system are designed to recover at least a portion of the initial adhesive bond strength through the application of joule heating. The adhesive bonding material, and possibly the materials bonded by the adhesive bonding material, is heated via an embedded heat source within the bonded system. The embedded heat source receives electric power from a controlled power source that selectively applies power to achieve optimum heating and adhesive bond strength recovery consistent with a characterization of the bonded system, heat source, and adhesive bonding material.
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