Toughness enhanced silicon-containing composite bodies, and methods for making same

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United States of America Patent

PATENT NO 6995103
APP PUB NO 20030092558A1
SERIAL NO

10271312

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Abstract

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A silicon-containing composite body that would otherwise be brittle can be engineered to exhibit enhanced fracture toughness. Specifically, a silicon-ceramic composite body is produced, preferably by a reactive infiltration technique. The ceramic is selected such that it has a higher coefficient of thermal expansion (CTE) than does the silicon phase. At least at some point during processing, the silicon phase is at a temperature above its normal ductile/brittle transition temperature of about 500° C., and preferably above its melting point. The formed composite body containing the silicon phase is then cooled below its ductile/brittle transition. During cooling, the ceramic phase shrinks more than does the silicon phase, thereby placing the latter in a state of compressive stress. By the time the composite body has cooled to substantially ambient temperature, the induced compressive stress in the silicon phase is sufficient as to impart a measurable degree of semi-ductile character to the silicon phase. This pseudo-ductility manifests itself in the composite body as a significant increase in the fracture toughness of the body. For example, when the ceramic reinforcement was boron carbide particulate instead of silicon carbide (which has a CTE similar to that of silicon), fracture toughness increased by almost 30 percent.

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Patent Owner(s)

Patent OwnerAddress
II-VI DELAWARE INC1100 NORTH MARKET STREET 4TH FLOOR WILMINGTON DE 19890

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aghajanian, Michael K Newark, DE 87 1361

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