Economical high density chip carrier
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United States of America Patent
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Feb 14, 2006
Grant Date -
May 27, 2004
app pub date -
Nov 18, 2003
filing date -
Apr 5, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for forming a flip-chip joinable substrate having non-plated-on contact pads. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area is selected. A microvia cavity extending to the internal contact area is perforated centrally within the selected area and is filled with a mass of conductive paste forming an external contact pad. The external contact pad is used as an etch mask for removing the adjacent external metal foil.
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