Chamber for uniform substrate heating
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United States of America Patent
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-
Feb 14, 2006
Grant Date -
Aug 5, 2004
app pub date -
Dec 15, 2003
filing date -
Dec 29, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In a first aspect, a first apparatus is provided for heating substrates. The first apparatus includes (1) a chamber having a bottom portion and a top portion; (2) a plurality of heated supports disposed within the chamber to support at least two substrates thereon; and (3) a heater disposed within the chamber between a sidewall of the chamber and the plurality of substrate supports and having an edge region and a center region. The heater is adapted to produce more heat within the edge region than within the center region of the heater. Numerous other aspects are provided.
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