Semiconductor device comprising memories on the inside and outside of bonding pad

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6998655
APP PUB NO 20030057454A1
SERIAL NO

10191474

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A semiconductor integrated circuit is capable of filling the need for more memory space through the effective use of an already-designed core block. A block (1) including a CPU, an array (4a) of a plurality of bonding pads, and RAMs (21a, 22a) which are first memories located on the same side of the array (4a) as the block (1) are already designed. The requirement for increased memory capacity can be filled with ease by the addition of RAMs (24a, 25a) which are second memories located on the opposite side of the array (4a) from the block (1). Since the second memories are different in physical configuration from the first memories, it is easy to design a physical configuration to achieve required memory capacity outside a core block (8a) within a single-chip microcomputer (9c).

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
RENESAS TECHNOLOGY CORPTOKYO TOKYO METROPOLIS

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sakakibara, Kazuo Hyogo, JP 12 230
Watanabe, Katsuyoshi Tokyo, JP 29 194

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation