Structures for testing circuits and methods for fabricating the structures
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United States of America Patent
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Feb 14, 2006
Issued Date -
N/A
app pub date -
Jun 28, 2005
filing date -
Mar 12, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a flexible substrate having contactors on a first side and pads on a second side; (b) a rigid substrate having vias aligned with the pads on the second side of the flexible substrate; (c) an adhesive layer comprised of a compliant adhesive material having vias aligned with the pads on the second side of the flexible substrate; the adhesive layer being affixed to the flexible substrate and the rigid substrate; (d) a card; (e) electrical connectors that are retained in the vias of the rigid substrate and the adhesive layer, which electrical connectors have first and second retractable ends, wherein the first retractable ends contact pads on the substrate, and the second retractable ends contact pads on the card; and (f) a clamp that is adapted to fit over the substrate and the adhesive layer, the clamp having an opening to provide access to the contactors, wherein the clamp is connected to the card.
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