Semiconductor device test arrangement with reassignable probe pads
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United States of America Patent
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Feb 14, 2006
Grant Date -
Jun 12, 2003
app pub date -
Dec 10, 2001
filing date -
Dec 10, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A test arrangement includes a semiconductor device, a first conductive pad electrically connected to the semiconductor device, a second conductive pad, and a programmable fuse. The second conductive pad is electrically connected to the semiconductor device through the programmable fuse.
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