Heated pressure transducer
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United States of America Patent
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-
Feb 21, 2006
Grant Date -
N/A
app pub date -
May 2, 2005
filing date -
May 2, 2005
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A pressure transducer assembly including a sensor enclosure, a pressure sensor received in the sensor enclosure, a tube connected to the pressure sensor and extending out of the sensor enclosure for connection to a source of fluid, an electronics circuit board electrically connected to the pressure sensor, and an electronics enclosure containing the electronics board and secured to the sensor enclosure. The electronics enclosure includes an external housing constructed of thermally conductive material, and a heat transfer plate constructed of thermally conductive material. The heat transfer plate is in physical contact with heat-generating elements of the electronics circuit board and in physical contact with the external housing, such that heat from the heat-generating elements can be dissipated through the external housing. This arrangement allows the circuit board to remain cool even as the sensor is heated.
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