Stencil and apparatus for supporting and tensioning the stencil
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United States of America Patent
Stats
-
Feb 21, 2006
Issued Date -
N/A
app pub date -
Nov 29, 2004
filing date -
Jul 20, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A support and tensioning frame for a stencil to enable solder paste to be applied to printed circuit boards and other electronic substrates includes a support frame engaged with at least two opposed mounting members. Each mounting member includes at least one projection for engaging an aperture in a stencil to mount the stencil under tension. A permanent-biasing mechanism engages one or more of the mounting members to place the stencil under tension. A second biasing mechanism engages the mounting member to provide a bias opposite that of the permanent-biasing mechanism to facilitate release of a mounted stencil.
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Cited Art Landscape
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