Electroplating apparatus and four mask TFT array process with electroplated metal
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United States of America Patent
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Feb 21, 2006
Grant Date -
Feb 27, 2003
app pub date -
Oct 10, 2002
filing date -
May 1, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.
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