Method and system for compensating thermally induced motion of probe cards
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United States of America Patent
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-
Feb 21, 2006
Issued Date -
N/A
app pub date -
Dec 27, 2001
filing date -
Nov 2, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.
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