Thermal pole-tip recession/slide shape variation reduction
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 21, 2006
Grant Date -
Nov 6, 2003
app pub date -
Dec 19, 2002
filing date -
May 2, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A bond pad is elevated from a slider body by a conductive post. The bond pad is disposed atop the post, which typically possesses a cross-sectional area smaller than the surface are of the bond pad. Thus, rather than having the entire surface of the bond pad in contact with the slider body, only the cross-sectional area of the conductive post is in contact therewith. Alternatively, a bond pad may be split into two electrically coupled pads: one pad used for housing a permanent bond, and a second pad used for housing a temporary bond. The pad used to house the temporary wire bond may be disposed atop a sacrificial layer. After a lapping process, the sacrificial layer may be etched away, thereby permitting the temporary pad to be removed.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully