Method for determining optimum bond parameters when bonding with a wire bonder
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United States of America Patent
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Feb 28, 2006
Issued Date -
N/A
app pub date -
Oct 16, 2003
filing date -
Oct 16, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A predetermined number of bond cycles is carried out in order to find optimum bond parameters for a wire bonder. The bond parameters to be optimized are each varied within a predefined range. With each bond cycle, after attachment of the wire to the connection point, the capillary is moved out of the bond position in a predetermined horizontal direction whereby the current flowing through the drive which moves the capillary is monitored and its maximum determined.
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