Film forming apparatus, film forming method and tray for substrate
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United States of America Patent
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Feb 28, 2006
Grant Date -
Jul 17, 2003
app pub date -
Dec 3, 2002
filing date -
Dec 3, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The object of the present invention is to provide an apparatus suitable for forming a thick film having a thickness on a surface of a substrate such as a glass substrate, a semiconductor wafer or the like. In the apparatus according to the present invention, a stock station for a substrate and a treatment station for a substrate are adjacent to each other, portions for coating, film-forming, cleaning and drying are provided in the treatment station, a tray having a concave portion for accommodating a substrate defined on the surface thereof is provided, and a transfer device circulates the tray around the portions for coating, film-forming, cleaning and drying.
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