Method of forming and adhesively bonded seam
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United States of America Patent
Stats
-
Feb 28, 2006
Grant Date -
Oct 20, 2005
app pub date -
May 21, 2004
filing date -
May 21, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method of forming a stitchless, adhesively bonded seam for a garment includes positioning an outside surface of a first sheet of fabric adjacent to an outside surface of a second sheet of fabric, and positioning a first strip of adhesive tape between the first and second sheets of fabric. A second strip of adhesive tape is positioned such that a first side is adjacent to a first portion of an inside surface of the second sheet of fabric, and the second sheet of fabric is folded such that a second portion of the inside surface of the second sheet of fabric overlaps a second side of the second strip of adhesive tape. The adhesively bonded seam is formed by applying energy to the first and second sheets of fabric and to the first and second strips of adhesive tape.
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