Controlled selectivity etch for use with optical component fabrication
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United States of America Patent
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Feb 28, 2006
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app pub date -
Jan 15, 2003
filing date -
Sep 6, 2002
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Abstract
A method of fabricating an optical component includes forming a mask on an optical component precursor. The method also includes etching through at least a portion of the mask so as to etch an underlying medium concurrently with remaining mask and transfer a feature of an upper surface of the mask onto an upper surface of the underlying medium. The etch can be configured such that a ratio of the underlying medium etch rate to the mask etch rate is less than about 1.5:1. In some instances, the underlying medium is silicon and the mask is a photoresist.
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