Importance

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Abstract

A thin-film RC circuit element suitable for a transmission line termination circuit is prepared by a process wherein 1) a first metal layer of an anodizable metal is deposited on a substrate; 2) the exposed surface of the anodizable metal layer is anodized to produce an oxide layer, 3) a second metal layer of electrically conductive metal is provided on the oxide layer, and 4) the first metal layer is etched to form an electrically resistive conductive path electrically connected to the region f the first metal layer beneath the second metal layer. A thin-film RC circuit element is also provided having a first layer of an anodizable metal formed on an electrically insulating substrate so as to provide two capacitor plates connected by a resistive strip, an oxide layer formed on the capacitor plates, and upper capacitor plates positioned on the oxide layer in register with the lower capacitor plates.

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First Claim