Anti tamper encapsulation for an integrated circuit
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United States of America Patent
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-
Feb 28, 2006
Grant Date -
Oct 25, 2001
app pub date -
Dec 26, 2000
filing date -
Dec 30, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit device comprising: a circuit which uses encryption; and an encapsulation packaging layer; in which the circuit is responsive to at least one physical parameter of the encapsulation to apply the encryption and/or decryption by reading the key therefrom, so that tampering with the encapsulation to gain access to the circuit causes the encryption and/or decryption to fail.
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