Optimization of routing layers and board space requirements for a ball grid array land pattern
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United States of America Patent
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Feb 28, 2006
Grant Date -
Apr 14, 2005
app pub date -
Aug 19, 2004
filing date -
Feb 25, 2003
priority date (Note) -
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Abstract
A method, system, and apparatus for optimizing routing layers and board space requirements for a ball grid array land pattern is described. The land pattern includes a plurality of conductive pads arranged in an array of rows and columns. The array of pads has at least one edge of a perimeter of the array not fully populated with conductive pads, whereby spaces are created in the at least one edge by the missing conductive pads. The spaces create additional routing channels for signals from conductive pads within the array to be routed externally to the array through the at least one edge.
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