US Patent No: 7,005,868

Number of patents in Portfolio can not be more than 2000

Apparatus and method for canceling DC errors and noise generated by ground shield current in a probe

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ALSO PUBLISHED AS: 20040196021
ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

A probe for connecting a device under test to a measurement device that corrects for dc errors and noise generated by the current flowing through the ground shield of a transmission line used by the probe. The probe identifies a voltage drop in the ground preferably using an additional line between the device under test and the measurement device. The signal provided to the measurement device is corrected based on the identified voltage drop.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
AGILENT TECHNOLOGIES, INC.PALO ALTO, CA4655

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
McTigue, Michael T Colorado Springs, CO 17 128

Cited Art

Patent Info (Count) # Cites Year
 
AGILENT TECHNOLOGIES, INC. (1)
6,804,807 Method of characterizing an electronic device having unbalanced ground currents 5 2003
 
INTEL CORPORATION (1)
6,856,129 Current probe device having an integrated amplifier 89 2002
 
NILSSON, ROBBINS, DALGARN, BERLINER, CARSON & WURST, 707 WILSHIRE BLVD., STE. 4750, LOS ANGELES, CA. 90017 (1)
4,542,302 Potential equalizing apparatus 7 1983
 
TEKTRONIX, INC. (1)
6,462,528 Method and apparatus for probing a conductor of an array of closely-spaced conductors 3 2000

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
CASCADE MICROTECH, INC. (91)
7,355,420 Membrane probing system 3 2002
7,178,236 Method for constructing a membrane probe using a depression 5 2003
7,250,779 Probe station with low inductance path 23 2003
7,761,986 Membrane probing method using improved contact 1 2003
7,368,925 Probe station with two platens 3 2004
7,400,155 Membrane probing system 0 2004
7,250,626 Probe testing structure 3 2004
7,221,172 Switched suspended conductor and connection 23 2004
7,492,172 Chuck for holding a device under test 4 2004
7,268,533 Optical testing device 3 2004
7,187,188 Chuck with integrated wafer support 74 2004
7,427,868 Active wafer probe 10 2004
7,266,889 Membrane probing system 7 2005
7,221,146 Guarded tub enclosure 5 2005
7,589,518 Wafer probe station having a skirting component 5 2005
7,554,322 Probe station 5 2005
7,330,041 Localizing a temperature of a device for testing 5 2005
7,330,023 Wafer probe station having a skirting component 3 2005
7,176,705 Thermal optical chuck 3 2005
7,368,927 Probe head having a membrane suspended probe 19 2005
7,352,168 Chuck for holding a device under test 9 2005
7,420,381 Double sided probing structures 1 2005
7,348,787 Wafer probe station having environment control enclosure 3 2005
7,656,172 System for testing semiconductors 3 2006
7,535,247 Interface for testing semiconductors 3 2006
7,271,603 Shielded probe for testing a device under test 32 2006
7,221,174 Probe holder for testing of a test device 0 2006
7,449,899 Probe for high frequency signals 0 2006
7,619,419 Wideband active-passive differential signal probe 0 2006
7,550,983 Membrane probing system with local contact scrub 0 2006
7,205,784 Probe for combined signals 2 2006
7,250,752 Probe station having multiple enclosures 3 2006
7,403,025 Membrane probing system 2 2006
7,295,025 Probe station with low noise characteristics 6 2006
7,292,057 Probe station thermal chuck with shielding for capacitive current 3 2006
7,533,462 Method of constructing a membrane probe 0 2006
7,504,823 Thermal optical chuck 2 2006
7,321,233 System for evaluating probing networks 7 2007
7,362,115 Chuck with integrated wafer support 14 2007
7,764,072 Differential signal probing system 1 2007
7,723,999 Calibration structures for differential signal probing 0 2007
7,403,028 Test structure and probe for differential signals 19 2007
7,285,969 Probe for combined signals 1 2007
7,443,186 On-wafer test structures for differential signals 2 2007
7,639,003 Guarded tub enclosure 2 2007
7,504,842 Probe holder for testing of a test device 0 2007
7,468,609 Switched suspended conductor and connection 4 2007
7,688,097 Wafer probe 1 2007
7,609,077 Differential signal probe with integral balun 0 2007
8,069,491 Probe testing structure 0 2007
7,498,828 Probe station with low inductance path 5 2007
7,436,170 Probe station having multiple enclosures 3 2007
7,492,147 Wafer probe station having a skirting component 3 2007
7,681,312 Membrane probing system 0 2007
7,541,821 Membrane probing system with local contact scrub 0 2007
7,453,276 Probe for combined signals 0 2007
7,518,387 Shielded probe for testing a device under test 1 2007
7,550,984 Probe station with low noise characteristics 3 2007
7,616,017 Probe station thermal chuck with shielding for capacitive current 0 2007
7,761,983 Method of assembling a wafer probe 1 2007
7,688,062 Probe station 0 2007
7,495,461 Wafer probe 0 2007
7,456,646 Wafer probe 1 2007
7,501,842 Shielded probe for testing a device under test 0 2007
7,498,829 Shielded probe for testing a device under test 1 2007
7,417,446 Probe for combined signals 1 2007
7,969,173 Chuck for holding a device under test 1 2007
7,518,358 Chuck for holding a device under test 11 2007
7,514,915 Chuck for holding a device under test 10 2007
7,501,810 Chuck for holding a device under test 10 2007
7,423,419 Chuck for holding a device under test 9 2007
7,626,379 Probe station having multiple enclosures 1 2007
7,489,149 Shielded probe for testing a device under test 1 2007
7,482,823 Shielded probe for testing a device under test 1 2007
7,436,194 Shielded probe with low contact resistance for testing a device under test 0 2007
7,595,632 Wafer probe station having environment control enclosure 5 2008
7,492,175 Membrane probing system 3 2008
7,688,091 Chuck with integrated wafer support 1 2008
7,514,944 Probe head having a membrane suspended probe 1 2008
7,750,652 Test structure and probe for differential signals 2 2008
8,013,623 Double sided probing structures 0 2008
7,876,114 Differential waveguide probe 0 2008
7,759,953 Active wafer probe 0 2008
7,888,957 Probing apparatus with impedance optimized interface 1 2008
7,898,281 Interface for testing semiconductors 0 2008
7,898,273 Probe for testing a device under test 0 2009
7,876,115 Chuck for holding a device under test 1 2009
7,893,704 Membrane probing structure with laterally scrubbing contacts 0 2009
8,319,503 Test apparatus for measuring a characteristic of a device under test 0 2009
8,410,806 Replaceable coupon for a probing apparatus 0 2009
7,940,069 System for testing semiconductors 1 2009

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Aug 28, 2013
11.5 Year Payment $7400.00 $3700.00 $1850.00 Aug 28, 2017
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00