Modular electronic assembly and method of making
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United States of America Patent
Stats
-
Feb 28, 2006
Grant Date -
Feb 10, 2005
app pub date -
Jul 14, 2004
filing date -
Jul 14, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A modular electronic assembly and a method for making a modular electronic assembly are disclosed. The subject modular electronic assembly is constructed in such a way as to maximize available surface area on printed wiring boards by incorporating pretested discrete passive elements within the body of such printed wiring boards and electrically connecting the elements in a volume-efficient manner. A modular electronic assembly constructed according to the presently disclosed subject matter is formed by arranging a plurality of diverse, pretested passive components between a plurality of copper and tacky epoxy sheets, holding the passive components in place by an epoxy resin layer and electrically connecting the components together by electrical vias penetrating the tacky epoxy layers. A modular electronic assembly according to the disclosed technology provides maximum available 'real estate' for mounting active and other components on the surface of printed wiring boards while significantly reducing the amount of lead (Pb) used to form similar known printed wiring boards.
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