TFI probe I/O wrap test method

United States of America Patent

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Mar 7, 2006
Grant Date
Jul 1, 2004
app pub date
Jan 26, 2004
filing date
Jul 13, 2000

priority date (Note)
Expired

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Abstract

A method for testing external connections to semiconductor devices. The method includes providing an external electrical path between selected external connections on the semiconductor devices.

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Patent Owner(s)

Patent Owner	Address
INTERNATIONAL BUSINESS MACHINES CORPORATION	ARMONK NY

International Classification(s)

H01K:ELECTRIC INCANDESCENT LAMPS

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Das, Gobinda	Hopewell Junction, NY	12	315
Motika, Franco	Hopewell Junction, NY	136	3809

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TFI probe I/O wrap test method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

10707926

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PATENT NO	7007380
APP PUB NO	20040124867A1
SERIAL NO	10707926
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 07, 2006	US,7007380,B2 US7007380B2	GRANTED PATENT AS SECOND PUBLICATION
July 01, 2004	US,20040124867,A1 US20040124867A1	FIRST PUBLISHED PATENT APPLICATION

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10707926

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