Resin sealing mold and resin sealing method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Mar 7, 2006
Issued Date -
N/A
app pub date -
Dec 14, 2000
filing date -
Dec 16, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).
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