Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation
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United States of America Patent
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Mar 7, 2006
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app pub date -
May 30, 2000
filing date -
May 30, 2000
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Abstract
The disclosed fabrication methodology addresses the problem of creating low-cost micro-electro-mechanical devices and systems, and, in particular, addresses the problem of delicate microstructures being damaged by the surface tension created as a wet etchant evaporates. This disclosure demonstrates a method for employing a dry plasma etch process to release encapsulated microelectromechanical components.
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