Method of fabricating an array of wafer scale polymeric caps
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 7, 2006
Grant Date -
Feb 24, 2005
app pub date -
Sep 27, 2004
filing date -
Jan 10, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of fabricating an array of wafer scale polymeric caps is provided. The method includes forming, in a two part mold, a plurality of first hollow molded caps from a layer of thermoplastic material which is placed in the mold. The mold has first and second mold halves which are brought together to form the caps. The first hollow molded caps are subsequently separated into an array of individual caps.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully