Semiconductor chip assembly with embedded metal particle
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United States of America Patent
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Mar 7, 2006
Issued Date -
N/A
app pub date -
Aug 19, 2004
filing date -
Oct 13, 2000
priority date (Note) -
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Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal particle, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line extends laterally beyond the metal particle towards the chip, and the chip and the metal particle are embedded in the encapsulant and extend vertically beyond the routing line in the same direction.
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