System and method for testing ball grid arrays
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United States of America Patent
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Mar 7, 2006
Issued Date -
N/A
app pub date -
Oct 10, 2003
filing date -
Oct 10, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus for testing ball grid arrays ('BGAs') is provided. The apparatus includes, a socket slot in a printed circuit board for holding a socket used for testing the BGAs; and plural holding members that support BGA solder balls. The socket top may have plural prong like holding members; plural circular holding members; and/or plural spiral holding members for supporting the solder balls. The holding members may be etched on a BGA socket top and are flexible, rigid and/or semi-rigid to provide support for the solder balls.
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