Probing method and probing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7009415
SERIAL NO

10870073

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a probing method comprising steps of moving a main chuck to align an object of inspection on the main chuck with probes of a probe card located over the main chuck, moving the main chuck toward the probe card, thereby bringing electrodes of the object of inspection into contact with the probes, overdriving the main chuck toward the probe card while measuring a load applied to the object of inspection by contact with the probes and controlling the movement of the main chuck in accordance with the measured load, and inspecting the electrical properties of the object of inspection by means of the probes.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishii, Kazunari Nirasaki, JP 35 275
Kobayashi, Masahito Fuchu, JP 75 853

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