US Patent No: 7,009,415
Number of patents in Portfolio can not be more than 2000
Probing method and probing apparatus
Stats
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Mar 7, 2006
Issued date -
Jun 18, 2004
filing date -
10/870,073
serial no -
In Force
status
Importance
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Abstract
Disclosed is a probing method comprising steps of moving a main chuck to align an object of inspection on the main chuck with probes of a probe card located over the main chuck, moving the main chuck toward the probe card, thereby bringing electrodes of the object of inspection into contact with the probes, overdriving the main chuck toward the probe card while measuring a load applied to the object of inspection by contact with the probes and controlling the movement of the main chuck in accordance with the measured load, and inspecting the electrical properties of the object of inspection by means of the probes.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 5,220,279 Probe apparatus | 25 | 1992 | |
| 5,410,259 Probing device setting a probe card parallel | 135 | 1993 | |
| 5,436,571 Probing test method of contacting a plurality of probes of a probe card with pads on a chip on a semiconductor wafer | 65 | 1994 | |
| 5,642,056 Probe apparatus for correcting the probe card posture before testing | 73 | 1994 | |
| 5,777,485 Probe method and apparatus with improved probe contact | 118 | 1996 | |
| 5,804,983 Probe apparatus with tilt correction mechanisms | 148 | 1997 | |
| 6,037,793 Inspecting method and apparatus for semiconductor integrated circuit | 72 | 1998 | |
| 6,118,290 Prober and method for cleaning probes provided therein | 12 | 1998 | |
| 5,968,282 Mechanism and method for cleaning probe needles | 25 | 1998 | |
| 6,501,289 Inspection stage including a plurality of Z shafts, and inspection apparatus | 83 | 2000 | |
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| 5,773,987 Method for probing a semiconductor wafer using a motor controlled scrub process | 57 | 1996 | |
| 5,872,458 Method for electrically contacting semiconductor devices in trays and test contactor useful therefor | 32 | 1996 | |
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| 4,934,064 Alignment method in a wafer prober | 32 | 1988 | |
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| 5,657,394 Integrated circuit probe card inspection system | 89 | 1993 | |
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| 5,916,009 Apparatus for applying an urging force to a wafer | 20 | 1997 | |
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| 4,758,785 Pressure control apparatus for use in an integrated circuit testing station | 112 | 1986 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 7, 2013 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 7, 2017 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |