Method for manufacturing a housing for a chip with a micromechanical structure
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United States of America Patent
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Mar 14, 2006
Grant Date -
May 19, 2005
app pub date -
Oct 12, 2004
filing date -
Apr 12, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
In a housing manufacturing method a base is provided with first contact elements with a photolithographically patternable layer that is patterned for exposing the contact elements. A chip with a micromechanical structure lying between second contact elements at the chip is provided with a photolithographically patternable layer which is patterned in order to provide a recess in the area of the micromechanical structure and in the area of the second contact elements. After joining the base and the chip the base is removed by etching.
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