Methods and apparatus for forming submicron patterns on films
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United States of America Patent
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Mar 21, 2006
Grant Date -
Nov 21, 2002
app pub date -
May 14, 2002
filing date -
Dec 23, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for forming a patterned film on a substrate, the method including: providing a first flowable medium on the substrate and a second flowable medium on the first flowable medium, the first and second flowable media having different dielectric properties and defining an interface there between; applying an electric field to the interface for a time sufficient to produce a structure in the first flowable medium along the interface: and hardening the structure in the first flowable medium to form the patterned film.
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