Room temperature cured high temperature and load dimensionally stable acrylate adhesives
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United States of America Patent
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Mar 21, 2006
Grant Date -
N/A
app pub date -
Nov 12, 2003
filing date -
Jun 14, 2000
priority date (Note) -
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Abstract
This invention concerns an acrylate adhesive that cures at room temperature and has excellent dimensional stability. The adhesive may be used in applications such as for fiber optic connectors. The adhesive may be made by curing a two-part system or by use of a primer-based system. The two part system may include an adhesive part A, which may include one or more monofunctional, difunctional, or trifunctional acrylate or methacrylate monomers, a peroxide or hydroperoxide free-radical initiator, an antioxidant, and optionally, additives such as thickeners, thixotropes, and adhesion promoters; and an activator part B, which may contain a N,N-disubstituted aromatic amine, a difunctional methacrylate monomer, an antioxidant, and optionally, additives such as thickeners, thixotropes, and adhesion promoters.
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