Importance

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Abstract

A back-to-back semiconductor device module includes two semiconductor devices, the backs of which are secured to one another. Each bond pad of both semiconductor devices is disposed adjacent a single, mutual edge of the module. The module may be oriented nonparallel to a carrier substrate and secured to the carrier substrate directly or indirectly thereto. A module-securing device for indirectly securing the module to the carrier substrate may include an alignment device with one or more receptacles formed therein and intermediate conductive elements that are disposed within the receptacles to establish electrical connections between the bond pads of the semiconductor devices and corresponding terminals of the carrier substrate. Alternatively, a clip-on lead, one end of which resiliently biases against a lead of at least one of the semiconductor devices, the other end of which is electrically connected to a terminal of the carrier substrate, may be employed as a module-securing device.

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First Claim