Method of manufacturing a semiconductor device and a semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Mar 21, 2006
Grant Date -
Jun 16, 2005
app pub date -
Feb 2, 2005
filing date -
Dec 20, 2000
priority date (Note) -
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Abstract
The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
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