Method of making a semiconductor chip assembly with an embedded metal particle
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United States of America Patent
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Mar 21, 2006
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N/A
app pub date -
Aug 24, 2004
filing date -
Oct 13, 2000
priority date (Note) -
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Abstract
A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip that includes a conductive pad to a routing line, mechanically attaching and electrically connecting a metal particle to the routing line, wherein the routing line extends laterally beyond the metal particle towards the chip and the chip and the metal particle extend vertically beyond the routing line in the same direction, forming an encapsulant after attaching the chip and the metal particle to the routing line wherein the chip and the metal particle are embedded in the encapsulant, and forming a connection joint that electrically connects the routing line and the pad.
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