Method and apparatus for cooling a module portion
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United States of America Patent
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Mar 21, 2006
Grant Date -
Mar 2, 2006
app pub date -
Aug 26, 2004
filing date -
Aug 26, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A method of cooling a module portion (202) of an embedded computer chassis (200), where the module portion comprises a front module (206) coupled to a front portion of a backplane (204), and a rear module (208) coupled to a rear portion of the backplane, where the front module and the rear module are horizontally disposed, the method includes drawing a cooling air mass (240) into the embedded computer chassis through a front surface (230) of a first interspace region (220) and an upper front surface (231) of a second interspace region (221) in a direction substantially perpendicular (250) to the front surface and the upper front surface. A third interspace region (222) receives a first portion of the cooling air mass (241), the cooling air mass exhausting from the embedded computer chassis through a rear surface (210) in a direction substantially perpendicular (256) to the rear surface.
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