Solder pastes for providing high elasticity, low rigidity solder joints
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United States of America Patent
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Mar 28, 2006
Issued Date -
N/A
app pub date -
Oct 1, 2004
filing date -
Nov 3, 2003
priority date (Note) -
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Abstract
Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity when the two parts are soldered together. In one particular exemplary embodiment, a solder paste may be realized as a composition comprising a solder powder and high melting temperature particles with a flux, wherein the ratio between solder powder and high melting temperature particles may be between 2:1 and 1:10.
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