Substrate and method of forming substrate for fluid ejection device
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United States of America Patent
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Mar 28, 2006
Issued Date -
N/A
app pub date -
Nov 18, 2004
filing date -
Jan 21, 2003
priority date (Note) -
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Abstract
A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.
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