Die attach material for TBGA or flexible circuitry
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United States of America Patent
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Mar 28, 2006
Issued Date -
N/A
app pub date -
Dec 21, 1999
filing date -
Dec 21, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An attachment material is provided between the die and the solder balls of a TBGA or other flexible circuitry package that is sufficiently compliant to absorb pressure between the two, so as not to apply stress to the solder balls. The attachment material is also sufficiently rigid, with a low coefficient of thermal expansion (CTE), so that the material does not excessively expand and contract during thermal cycling relative to the die. More preferably, the attachment material has a CTE close to that of the die to prevent breakage of the tape at the junction between the tape and the die.
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