Chucking system for modulating shapes of substrates
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United States of America Patent
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Mar 28, 2006
Grant Date -
May 13, 2004
app pub date -
Nov 13, 2002
filing date -
Nov 13, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.
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