One-pack moisture-curing epoxy resin composition
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 4, 2006
Grant Date -
Jan 29, 2004
app pub date -
Dec 17, 2001
filing date -
Dec 18, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition includes one ore more members selected from the group consisting of vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds of the general formula (2), one or more members selected from the group consisting of ketimines and oxazolidines, and an epoxy resin. (1) [In the general formula (1), R1, R2, R3, and R4 are each independently hydrogen or an organic group; and n is an integer of 1 or above] (2) [In the general formula (2), R5 and R6 are each independently alkyl; R7 is an epoxy-containing organic group; and n is an integer of 1 to 3] ##STR1##
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully