Importance

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Abstract

A hermetic package of a type used to contain a sensing element, such as an infrared sensing element. The package comprises a base having a base wall and sidewalls surrounding the base wall to define a first recess within the base. The sensing element is fabricated on a device chip disposed within the first recess. A lid is hermetically sealed with the base to enclose the sensing element. The lid defines a second recess that communicates with the first recess, such that the first and second recesses define a continuous cavity between the lid and the base and in which the device chip is contained. The depth of the second recess is preferably at least about half the depth of the sensing element within the first recess, such that neither the lid nor the base are required to have a deep recess that defines essentially the entire cavity in which the device chip is contained.

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First Claim