Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
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United States of America Patent
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Apr 4, 2006
Issued Date -
N/A
app pub date -
Jan 3, 2005
filing date -
Dec 10, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
Methods of fabricating leadless packages are described that provide good solder joint reliability. In most respects, the packages are fabricated in a manner similar to current lead frame based leadless packaging techniques. However, at some point in the process, the contacts are provided with undercut regions that are left exposed during solder plating so that the solder plating also covers the exposed side and undercut segments of the contacts. When the resultant devices are soldered to an appropriate substrate (after singulation), each resulting solder joint includes a fillet that adheres very well to the undercut portion of contact. This provides a high quality solder joint that can be visually inspected from the side of the package.
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