Wafer-mounted micro-probing platform
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United States of America Patent
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Apr 4, 2006
Grant Date -
Oct 21, 2004
app pub date -
Apr 16, 2003
filing date -
Apr 16, 2003
priority date (Note) -
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Abstract
A method and apparatus for probing semiconductor circuits using a wafer-mounted micro-probing platform. A platform or platen is affixed to the surface of a wafer. Probe manipulators are mounted on the platen, and probes extend from or are otherwise associated with the probe manipulators. The probe manipulators may be fixed in position, or they may be motorized to allow adjustment of the probe positions while in-situ. During probing, electrical signals are preferably sent to the probes viz.-a-viz. feedthrough interfaces. The platen which is affixed to the surface of the wafer effectively serves two purposes: 1) as a mounting point for the probe manipulators; and 2) to mechanically stiffen the wafer so that the wafer does not flex, thereby requiring re-positioning of the probes.
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