Device for cooling memory modules

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United States of America Patent

PATENT NO 7023701
SERIAL NO

10829362

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Abstract

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A device for cooling memory modules can include a plurality of elements. The elements can thermal couple at least two memory modules. The device can further include a body or a plurality of contact areas bearing in a planar manner.

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Patent Owner(s)

Patent OwnerAddress
POLARIS INNOVATIONS LIMITED29 EARLSFORT TERRACE DUBLIN 2 DUBLIN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huber, Thomas München, DE 244 4313
Proll, Manfred Dorfen, DE 33 233
Schroder, Stephan München, DE 30 158
Stocken, Christian München, DE 12 180

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