System and method of measuring thermal expansion
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United States of America Patent
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Apr 11, 2006
Grant Date -
Dec 2, 2004
app pub date -
May 30, 2003
filing date -
May 30, 2003
priority date (Note) -
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Abstract
A chuck having a high specific stiffness and high thermal conductivity compared to conventional chucks, with an apparatus for measuring thermal expansion in the chuck. High specific stiffness allows for a higher control bandwidth and improved scanning performance. High thermal conductivity enables excellent positioning accuracy because thermal expansion and strain may be accurately measured or predicted, and thus compensated.
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